CEM-3 composite base copper clad plate
FUJIAN LIHAO ELECTRONIC TECHNOLOGY CO., LTD.
Xiamei Town, Nanan city, Fujian Province
TEL:0595-86785298 FAX：0595-86785296
CEM-3 TDS
CEM-3 Single Sided
CEM-3 is a composite substrate (fiberglass paper, fiberglass cloth) copper clad laminate with excellent performance in flame resistance and dimensional stability.It has good heat and humidity resistance and is suitable for cold punching.
Grade and Construction
Type | Grade | Construction |
CEM-3 | CPFCP(G)-41F | Phenolic resin,epoxy resin,fiberglass cloth, fiberglass paper,copper foil |
Feature
Low cost but with wide range of application
Warpage and twist are small and stable
Excellent heat and humidity resistance
Excellent dimensional stability
Standard configuration
Thickness ：0.8mm-1.6mm
Regular Size(mm) ：1041*1245
Other Size：As specified by customers
General Properties
NO. | Item | Unit | Test Condition | Standard Value | Typical Value |
| 1 | （260℃） Solder resistance | 秒/Sec | A | ≥10 | 18 |
| 2 | Peel Strength (Copper Foil 25μm) | N/mm | A | ≥1.2 | 1.4-1.6 |
| 3 | Fleural Strength | MPa | Lengthwise | ≥276 | 312 |
| Crosswise | ≥186 | 138 | |||
| 4 | Water Absorption | % | E-24+D-24/23 | ≤0.5 | 0.43 |
| 5 | Surface Resistance | MΩ | C-96/35/90 | ≥1.0*104 | 3.5*104 |
| 6 | Volume Resistivity | MΩ.cm | C-96/35/90 | ≥1.0*106 | 6.3*106 |
| 7 | （1MHz） Dielectric Constant | - | C-96/40/90 | ≤5.4 | 4.4 |
| 8 | （1MHz） Dissipation Factor | C-96/40/90 | ≤0.035 | 0.032 | |
| 9 | Punching Temperature | ℃ | Ambient -90 | 50-90 |
Remark:
1.The test methods are according to GB/T 4722-2017
2,Packing, marking, transportation and storage shall be in accordance with GB/T 4721
3. Specimen Thickness:1.6mm, Typical values for reference only